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Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed

dc.contributor.authorArmini, Silvia
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorRodet, Simon
dc.contributor.authorHonore, Mia
dc.contributor.authorRadisic, Alex
dc.contributor.authorCivale, Yann
dc.contributor.authorBeyne, Eric
dc.contributor.authorLeunissen, Peter
dc.date.accessioned2021-10-19T12:29:33Z
dc.date.available2021-10-19T12:29:33Z
dc.date.issued2011
dc.identifier.issn0013-4651
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18488
dc.sourceIIOimport
dc.titleVoid-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed
dc.typeJournal article
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpageH160
dc.source.endpageH165
dc.source.journalJournal of the Electrochemical Society
dc.source.issue2
dc.source.volume158
imec.availabilityPublished - open access


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