dc.contributor.author | Armini, Silvia | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Volders, Henny | |
dc.contributor.author | El-Mekki, Zaid | |
dc.contributor.author | Radisic, Alex | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Ruythooren, Wouter | |
dc.contributor.author | Vereecken, Philippe | |
dc.date.accessioned | 2021-10-19T12:29:36Z | |
dc.date.available | 2021-10-19T12:29:36Z | |
dc.date.issued | 2011 | |
dc.identifier.issn | 0167-9317 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18489 | |
dc.source | IIOimport | |
dc.title | Impact of "terminal effect" on Cu electrochemical deposition: filling capability for different metallization options | |
dc.type | Journal article | |
dc.contributor.imecauthor | Armini, Silvia | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Volders, Henny | |
dc.contributor.imecauthor | El-Mekki, Zaid | |
dc.contributor.imecauthor | Radisic, Alex | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Ruythooren, Wouter | |
dc.contributor.imecauthor | Vereecken, Philippe | |
dc.contributor.orcidimec | Armini, Silvia::0000-0003-0578-3422 | |
dc.contributor.orcidimec | Vereecken, Philippe::0000-0003-4115-0075 | |
dc.contributor.orcidimec | El-Mekki, Zaid::0000-0002-9851-9139 | |
dc.identifier.doi | 10.1016/j.mee.2010.08.013 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 754 | |
dc.source.endpage | 759 | |
dc.source.journal | Microelectronic Engineering | |
dc.source.issue | 5 | |
dc.source.volume | 88 | |
imec.availability | Published - imec | |