Show simple item record

Through-silicon via technology for 3D IC

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-19T12:35:21Z
dc.date.available2021-10-19T12:35:21Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18576
dc.sourceIIOimport
dc.titleThrough-silicon via technology for 3D IC
dc.typeBook chapter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage93
dc.source.bookUltra-Thin Chip Technology and Applications
dc.source.endpage108
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
25387.pdf
Size:
8.942Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record