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Interconnect reliability – A study of the effect of dimensional and porosity scaling

dc.contributor.authorCroes, Kristof
dc.contributor.authorWilson, Chris
dc.contributor.authorLofrano, Melina
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-19T12:59:18Z
dc.date.available2021-10-19T12:59:18Z
dc.date.issued2011
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18754
dc.sourceIIOimport
dc.titleInterconnect reliability – A study of the effect of dimensional and porosity scaling
dc.typeJournal article
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage614
dc.source.endpage619
dc.source.journalMicroelectronic Engineering
dc.source.issue5
dc.source.volume88
imec.availabilityPublished - imec


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