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Cu pumping in TSVs: Effect of pre-CMP thermal budget

dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCroes, Kristof
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorLabie, Riet
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorVan De Peer, Myriam
dc.contributor.authorVanstreels, Kris
dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-19T13:10:18Z
dc.date.available2021-10-19T13:10:18Z
dc.date.issued2011
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18813
dc.sourceIIOimport
dc.titleCu pumping in TSVs: Effect of pre-CMP thermal budget
dc.typeJournal article
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorVan De Peer, Myriam
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1856
dc.source.endpage1859
dc.source.journalMicroelectronics Reliability
dc.source.issue9_11
dc.source.volume51
imec.availabilityPublished - imec
imec.internalnotesESREF paper


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