dc.contributor.author | De Wolf, Ingrid | |
dc.contributor.author | Croes, Kristof | |
dc.contributor.author | Varela Pedreira, Olalla | |
dc.contributor.author | Labie, Riet | |
dc.contributor.author | Redolfi, Augusto | |
dc.contributor.author | Van De Peer, Myriam | |
dc.contributor.author | Vanstreels, Kris | |
dc.contributor.author | Okoro, Chukwudi | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-19T13:10:18Z | |
dc.date.available | 2021-10-19T13:10:18Z | |
dc.date.issued | 2011 | |
dc.identifier.issn | 0026-2714 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18813 | |
dc.source | IIOimport | |
dc.title | Cu pumping in TSVs: Effect of pre-CMP thermal budget | |
dc.type | Journal article | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.imecauthor | Croes, Kristof | |
dc.contributor.imecauthor | Varela Pedreira, Olalla | |
dc.contributor.imecauthor | Labie, Riet | |
dc.contributor.imecauthor | Redolfi, Augusto | |
dc.contributor.imecauthor | Van De Peer, Myriam | |
dc.contributor.imecauthor | Vanstreels, Kris | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1856 | |
dc.source.endpage | 1859 | |
dc.source.journal | Microelectronics Reliability | |
dc.source.issue | 9_11 | |
dc.source.volume | 51 | |
imec.availability | Published - imec | |
imec.internalnotes | ESREF paper | |