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Polymer filling of silicon trenches for 3D through silicon vias applications

dc.contributor.authorDuval, Fabrice
dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorCivale, Yann
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-19T13:20:25Z
dc.date.available2021-10-19T13:20:25Z
dc.date.issued2011
dc.identifier.issn1521-3331
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18861
dc.sourceIIOimport
dc.titlePolymer filling of silicon trenches for 3D through silicon vias applications
dc.typeJournal article
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage825
dc.source.endpage831
dc.source.journalIEEE Transactions on Components and Packaging Technologies
dc.source.issue6
dc.source.volume1
imec.availabilityPublished - open access


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