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3-D antenna-in-packaging solution for microwave wireless sensor networks nodes

dc.contributor.authorEnayati, Amin
dc.contributor.authorBrebels, Steven
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorVandenbosch, Guy
dc.date.accessioned2021-10-19T13:24:24Z
dc.date.available2021-10-19T13:24:24Z
dc.date.issued2011
dc.identifier.issn0018-926X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18878
dc.sourceIIOimport
dc.title3-D antenna-in-packaging solution for microwave wireless sensor networks nodes
dc.typeJournal article
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage3617
dc.source.endpage3623
dc.source.journalIEEE Transactions on Antennas and Propagation
dc.source.issue10
dc.source.volume59
dc.identifier.urlhttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5976383
imec.availabilityPublished - open access


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