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The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects

dc.contributor.authorHsu, Yung-Yu
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorAxisa, Fabrice
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-19T14:25:05Z
dc.date.available2021-10-19T14:25:05Z
dc.date.issued2011
dc.identifier.issn0040-6090
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19096
dc.sourceIIOimport
dc.titleThe effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects
dc.typeJournal article
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage2225
dc.source.endpage2234
dc.source.journalThin Solid Films
dc.source.issue7
dc.source.volume519
imec.availabilityPublished - imec


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