Show simple item record

Characterization and modeling of through silicon via (TSV) and its impact on 3D circuits and systems

dc.contributor.authorKatti, Guruprasad
dc.date.accessioned2021-10-19T14:45:22Z
dc.date.available2021-10-19T14:45:22Z
dc.date.issued2011-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19161
dc.sourceIIOimport
dc.titleCharacterization and modeling of through silicon via (TSV) and its impact on 3D circuits and systems
dc.typePHD thesis
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorDehaene, Wim
dc.contributor.thesisadvisorDe Meyer, Kristin
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
24001.pdf
Size:
3.978Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record