dc.contributor.author | La Manna, Antonio | |
dc.contributor.author | Limaye, Paresh | |
dc.contributor.author | Decoutere, Stefaan | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-19T15:06:31Z | |
dc.date.available | 2021-10-19T15:06:31Z | |
dc.date.issued | 2011-01 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/19224 | |
dc.source | IIOimport | |
dc.title | Il packaging dei dispositivi GaN-on-Si | |
dc.type | Journal article | |
dc.contributor.imecauthor | La Manna, Antonio | |
dc.contributor.imecauthor | Decoutere, Stefaan | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Decoutere, Stefaan::0000-0001-6632-6239 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | no | |
dc.source.beginpage | 56 | |
dc.source.endpage | 58 | |
dc.source.journal | PCB Magazine | |
dc.source.issue | Gennaio | |
imec.availability | Published - imec | |