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Electromigration in solder interconnects

dc.contributor.authorLabie, Riet
dc.date.accessioned2021-10-19T15:07:43Z
dc.date.available2021-10-19T15:07:43Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19228
dc.sourceIIOimport
dc.titleElectromigration in solder interconnects
dc.typeBook chapter
dc.contributor.imecauthorLabie, Riet
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.source.peerreviewno
dc.source.beginpage161
dc.source.bookThe ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-free Solder Interconnects
dc.source.endpage178
imec.availabilityPublished - imec
imec.internalnotesChapter 7


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