Micro bump assembly
| dc.contributor.author | Limaye, Paresh | |
| dc.contributor.author | Zhang, Wenqi | |
| dc.date.accessioned | 2021-10-19T15:32:22Z | |
| dc.date.available | 2021-10-19T15:32:22Z | |
| dc.date.issued | 2011 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/19302 | |
| dc.source | IIOimport | |
| dc.title | Micro bump assembly | |
| dc.type | Book chapter | |
| dc.date.embargo | 9999-12-31 | |
| dc.source.peerreview | no | |
| dc.source.beginpage | 185 | |
| dc.source.book | Ultra-Thin Chip Technology and Applications | |
| dc.source.endpage | 194 | |
| imec.availability | Published - open access |