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Thermal optimization of GaN-on-Si HEMTs with plastic package

dc.contributor.authorLiu, Rui
dc.contributor.authorSchreurs, Dominique
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorVanaverbeke, Fre
dc.contributor.authorMertens, Robert
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-19T15:38:13Z
dc.date.available2021-10-19T15:38:13Z
dc.date.issued2011
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19318
dc.sourceIIOimport
dc.titleThermal optimization of GaN-on-Si HEMTs with plastic package
dc.typeJournal article
dc.contributor.imecauthorSchreurs, Dominique
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorMertens, Robert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage1788
dc.source.endpage1791
dc.source.journalMicroelectronics Reliability
dc.source.issue9_11
dc.source.volume51
imec.availabilityPublished - imec


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