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Influence of test structure design on stress-induced-voiding using an experimentally validated finite element modeling approach

dc.contributor.authorLofrano, Melina
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorWilson, Chris
dc.date.accessioned2021-10-19T15:41:25Z
dc.date.available2021-10-19T15:41:25Z
dc.date.issued2011
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19327
dc.sourceIIOimport
dc.titleInfluence of test structure design on stress-induced-voiding using an experimentally validated finite element modeling approach
dc.typeJournal article
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorWilson, Chris
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage1578
dc.source.endpage1581
dc.source.journalMicroelectronics Reliability
dc.source.issue9_11
dc.source.volume51
imec.availabilityPublished - imec
imec.internalnotesESREF paper


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