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Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance

dc.contributor.authorMarsik, Premysl
dc.contributor.authorUrbanowicz, Adam
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorDe Roest, David
dc.contributor.authorSprey, Hessel
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-19T16:05:11Z
dc.date.available2021-10-19T16:05:11Z
dc.date.issued2011
dc.identifier.issn0040-6090
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19390
dc.sourceIIOimport
dc.titleEffect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance
dc.typeJournal article
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorSprey, Hessel
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage3619
dc.source.endpage3626
dc.source.journalThin Solid Films
dc.source.issue11
dc.source.volume519
imec.availabilityPublished - open access


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