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dc.contributor.authorNguyen, Hai P.
dc.contributor.authorSu, Jiale
dc.contributor.authorVullers, Ruud
dc.contributor.authorVereecken, Philippe
dc.contributor.authorFransaer, Jan
dc.date.accessioned2021-10-19T16:40:59Z
dc.date.available2021-10-19T16:40:59Z
dc.date.issued2011
dc.identifier.issn0884-2914
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19479
dc.sourceIIOimport
dc.titleMeasurement of Seebeck coefficient of electroplated thermoelectric films in presence of a seed layer
dc.typeJournal article
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewyes
dc.source.beginpage1953
dc.source.endpage1957
dc.source.journalJournal of Materials Research
dc.source.issue15
dc.source.volume26
imec.availabilityPublished - imec


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