Measurement of Seebeck coefficient of electroplated thermoelectric films in presence of a seed layer
dc.contributor.author | Nguyen, Hai P. | |
dc.contributor.author | Su, Jiale | |
dc.contributor.author | Vullers, Ruud | |
dc.contributor.author | Vereecken, Philippe | |
dc.contributor.author | Fransaer, Jan | |
dc.date.accessioned | 2021-10-19T16:40:59Z | |
dc.date.available | 2021-10-19T16:40:59Z | |
dc.date.issued | 2011 | |
dc.identifier.issn | 0884-2914 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/19479 | |
dc.source | IIOimport | |
dc.title | Measurement of Seebeck coefficient of electroplated thermoelectric films in presence of a seed layer | |
dc.type | Journal article | |
dc.contributor.imecauthor | Vereecken, Philippe | |
dc.contributor.orcidimec | Vereecken, Philippe::0000-0003-4115-0075 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1953 | |
dc.source.endpage | 1957 | |
dc.source.journal | Journal of Materials Research | |
dc.source.issue | 15 | |
dc.source.volume | 26 | |
imec.availability | Published - imec |
Files in this item
Files | Size | Format | View |
---|---|---|---|
There are no files associated with this item. |