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Novel Cu-Cu bonding technique: the insertion bonding approach

dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorLimaye, Paresh
dc.contributor.authorAgarwal, Rahul
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandepitte, Dirk
dc.date.accessioned2021-10-19T16:52:15Z
dc.date.available2021-10-19T16:52:15Z
dc.date.issued2011
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19507
dc.sourceIIOimport
dc.titleNovel Cu-Cu bonding technique: the insertion bonding approach
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1885
dc.source.endpage1894
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue12
dc.source.volume1
imec.availabilityPublished - open access


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