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Laser-based surface acoustic wave dispersion spectroscopy for extraction of thicknesses, depth, and elastic parameters of a subsurface layer: Feasibility study on intermetallic layer structure in integrated circuit solder joint

dc.contributor.authorSalenbien, R.
dc.contributor.authorCote, R.
dc.contributor.authorGoossens, J.
dc.contributor.authorLimaye, Paresh
dc.contributor.authorLabie, Riet
dc.contributor.authorGlorieux, C.
dc.date.accessioned2021-10-19T18:21:59Z
dc.date.available2021-10-19T18:21:59Z
dc.date.issued2011
dc.identifier.issn0021-8979
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19719
dc.sourceIIOimport
dc.titleLaser-based surface acoustic wave dispersion spectroscopy for extraction of thicknesses, depth, and elastic parameters of a subsurface layer: Feasibility study on intermetallic layer structure in integrated circuit solder joint
dc.typeJournal article
dc.contributor.imecauthorLabie, Riet
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.source.peerreviewyes
dc.source.beginpage93101
dc.source.journalJournal of Applied Physics
dc.source.issue9
dc.source.volume109
imec.availabilityPublished - imec


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