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Die-to-die adhesive bonding procedure for evanescently-coupled photonic devices

dc.contributor.authorStankovic, Stevan
dc.contributor.authorJones, R.
dc.contributor.authorHeck, J.
dc.contributor.authorSysak, M.
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorRoelkens, Gunther
dc.date.accessioned2021-10-19T19:13:13Z
dc.date.available2021-10-19T19:13:13Z
dc.date.issued2011-05
dc.identifier.issn1099-0062
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19830
dc.sourceIIOimport
dc.titleDie-to-die adhesive bonding procedure for evanescently-coupled photonic devices
dc.typeJournal article
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage326
dc.source.endpage329
dc.source.journalElectrochemical and Solid-State Letters
dc.source.issue8
dc.source.volume14
imec.availabilityPublished - open access


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