Show simple item record

A comprehensive LER-aware TDDB lifetime model for advanced Cu interconnects

dc.contributor.authorStucchi, Michele
dc.contributor.authorRoussel, Philippe
dc.contributor.authorTokei, Zsolt
dc.contributor.authorDemuynck, Steven
dc.contributor.authorGroeseneken, Guido
dc.date.accessioned2021-10-19T19:20:48Z
dc.date.available2021-10-19T19:20:48Z
dc.date.issued2011
dc.identifier.issn1530-4388
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19847
dc.sourceIIOimport
dc.titleA comprehensive LER-aware TDDB lifetime model for advanced Cu interconnects
dc.typeJournal article
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage278
dc.source.endpage289
dc.source.journalIEEE Transactions on Device and Materials Reliability
dc.source.issue2
dc.source.volume11
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
22408.pdf
Size:
1.161Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record