Show simple item record

Excessive warpage of large packages during reflow soldering

dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-19T20:41:17Z
dc.date.available2021-10-19T20:41:17Z
dc.date.issued2011-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20016
dc.sourceIIOimport
dc.titleExcessive warpage of large packages during reflow soldering
dc.typeBook chapter
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage283
dc.source.bookThe ELFNET Book on Failure Mechanisms, Testing Methods and Quality Issues of Lead Free Solder Interconnects
dc.source.endpage296
imec.availabilityPublished - open access
imec.internalnotesChapter 13


Files in this item

Thumbnail
Name:
19518.pdf
Size:
950.3Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record