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Texture characterization of Cu interconnects with different Ta-based sidewall diffusion barriers

dc.contributor.authorWilson, Chris
dc.contributor.authorZhao, Chao
dc.contributor.authorVolders, Henny
dc.contributor.authorZhao, Larry
dc.contributor.authorCroes, Kristof
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-19T21:49:41Z
dc.date.available2021-10-19T21:49:41Z
dc.date.issued2011
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20150
dc.sourceIIOimport
dc.titleTexture characterization of Cu interconnects with different Ta-based sidewall diffusion barriers
dc.typeJournal article
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorVolders, Henny
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage656
dc.source.endpage660
dc.source.journalMicroelectronic Engineering
dc.source.issue5
dc.source.volume88
dc.identifier.urlhttp://dx.doi.org/10.1016/j.mee.2010.06.014
imec.availabilityPublished - imec


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