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dc.contributor.authorZhang, Wenqi
dc.contributor.authorLimaye, Paresh
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyne, Eric
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-19T22:21:13Z
dc.date.available2021-10-19T22:21:13Z
dc.date.issued2011
dc.identifier.issn1555-9270
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20211
dc.sourceIIOimport
dc.title3D
dc.typeJournal article
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage11
dc.source.endpage13
dc.source.journalSemiconductor Manufacturing China
dc.source.issue4
dc.source.volume12
imec.availabilityPublished - open access


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