Show simple item record

Structural characterization of through silicon vias (TSV)

dc.contributor.authorBender, Hugo
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorVan Marcke, Patricia
dc.contributor.authorGeypen, Jef
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorRadisic, Alex
dc.date.accessioned2021-10-20T10:05:26Z
dc.date.available2021-10-20T10:05:26Z
dc.date.issued2012
dc.identifier.issn0022-2461
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20353
dc.sourceIIOimport
dc.titleStructural characterization of through silicon vias (TSV)
dc.typeJournal article
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorVan Marcke, Patricia
dc.contributor.imecauthorGeypen, Jef
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorRadisic, Alex
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.date.embargo9999-12-31
dc.identifier.doi10.1007/s10853-010-5144-6
dc.source.peerreviewyes
dc.source.beginpage6497
dc.source.endpage6504
dc.source.journalJournal of Materials Science
dc.source.issue18
dc.source.volume47
imec.availabilityPublished - open access
imec.internalnotesE-MRS Spring 2010


Files in this item

Thumbnail
Name:
21951.pdf
Size:
539.6Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record