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Mechanism of copper deposition on silicon from dilute hydrofluoric acid solution

dc.contributor.authorNorga, Gerd
dc.contributor.authorPlatero, M.
dc.contributor.authorBlack, K. A.
dc.contributor.authorReddy, A. J.
dc.contributor.authorMichel, J.
dc.contributor.authorKimerling, L. C.
dc.date.accessioned2021-09-30T09:21:21Z
dc.date.available2021-09-30T09:21:21Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2060
dc.sourceIIOimport
dc.titleMechanism of copper deposition on silicon from dilute hydrofluoric acid solution
dc.typeJournal article
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage2801
dc.source.endpage2810
dc.source.journalJ. Electrochem. Soc.
dc.source.issue8
dc.source.volume144
imec.availabilityPublished - open access


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