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Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures

dc.contributor.authorDimcic, Biljana
dc.contributor.authorLabie, Riet
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorVanstreels, Kris
dc.contributor.authorCroes, Kristof
dc.contributor.authorVerlinden, Bert
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-20T10:44:59Z
dc.date.available2021-10-20T10:44:59Z
dc.date.issued2012
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20612
dc.sourceIIOimport
dc.titleDiffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures
dc.typeJournal article
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1971
dc.source.endpage197
dc.source.journalMicroelectronics Reliability
dc.source.issue9_10
dc.source.volume52
imec.availabilityPublished - open access
imec.internalnotesESREF paper


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