dc.contributor.author | Ivankovic, Andrej | |
dc.contributor.author | Vanstreels, Kris | |
dc.contributor.author | Vanderstraeten, Daniel | |
dc.contributor.author | Brizar, Guy | |
dc.contributor.author | Gillon, Renaud | |
dc.contributor.author | Blansaer, Eddy | |
dc.contributor.author | Vandevelde, Bart | |
dc.date.accessioned | 2021-10-20T11:49:44Z | |
dc.date.available | 2021-10-20T11:49:44Z | |
dc.date.issued | 2012 | |
dc.identifier.issn | 0026-2714 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/20853 | |
dc.source | IIOimport | |
dc.title | Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging | |
dc.type | Journal article | |
dc.contributor.imecauthor | Vanstreels, Kris | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 2677 | |
dc.source.endpage | 2684 | |
dc.source.journal | Microelectronics Reliability | |
dc.source.issue | 11 | |
dc.source.volume | 52 | |
imec.availability | Published - imec | |