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Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging

dc.contributor.authorIvankovic, Andrej
dc.contributor.authorVanstreels, Kris
dc.contributor.authorVanderstraeten, Daniel
dc.contributor.authorBrizar, Guy
dc.contributor.authorGillon, Renaud
dc.contributor.authorBlansaer, Eddy
dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-20T11:49:44Z
dc.date.available2021-10-20T11:49:44Z
dc.date.issued2012
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20853
dc.sourceIIOimport
dc.titleComparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
dc.typeJournal article
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewyes
dc.source.beginpage2677
dc.source.endpage2684
dc.source.journalMicroelectronics Reliability
dc.source.issue11
dc.source.volume52
imec.availabilityPublished - imec


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