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Design of test structures for the characterization of thermal-mechanical stress in 3D stacked IC

dc.contributor.authorMinas, Nikolaos
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorOprins, Herman
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorCherman, Vladimir
dc.contributor.authorTorregiani, Cristina
dc.contributor.authorRakowski, Michal
dc.contributor.authorMarchal, Pol
dc.date.accessioned2021-10-20T13:31:49Z
dc.date.available2021-10-20T13:31:49Z
dc.date.issued2012
dc.identifier.issn0894-6507
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21147
dc.sourceIIOimport
dc.titleDesign of test structures for the characterization of thermal-mechanical stress in 3D stacked IC
dc.typeJournal article
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorRakowski, Michal
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage365
dc.source.endpage371
dc.source.journalIEEE Transactions on Semiconductor Manufacturing
dc.source.issue3
dc.source.volume25
imec.availabilityPublished - open access


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