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Design and characterization of a biocompatible packaging concept for implantable electronic devices

dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorQian, Karen
dc.contributor.authorFiorini, Paolo
dc.contributor.authorMalachowski, Karl
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-20T14:05:30Z
dc.date.available2021-10-20T14:05:30Z
dc.date.issued2012
dc.identifier.issn1551-4897
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21231
dc.sourceIIOimport
dc.titleDesign and characterization of a biocompatible packaging concept for implantable electronic devices
dc.typeJournal article
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.source.peerreviewyes
dc.source.beginpage43
dc.source.endpage50
dc.source.journalJournal of Microelectronics and Electronic Packaging
dc.source.issue1
dc.source.volume9
dc.identifier.urlhttp://www.imaps.org/imapsstore/detail.aspx?ID=3928
imec.availabilityPublished - imec


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