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Modeling and experimental characterization of hot spot dissipation in 3D stacks

dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.date.accessioned2021-10-20T14:06:15Z
dc.date.available2021-10-20T14:06:15Z
dc.date.issued2012-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21233
dc.sourceIIOimport
dc.titleModeling and experimental characterization of hot spot dissipation in 3D stacks
dc.typeJournal article
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.source.peerreviewno
dc.source.beginpage18
dc.source.endpage23
dc.source.journalElectronics Cooling
dc.source.issue2
dc.source.volume18
dc.identifier.urlhttp://s3.electronics-cooling.com/issues/ECM_June2012.pdf
imec.availabilityPublished - imec


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