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Anisotropic vapor HF etching of silicon dioxide for Si microstructure release

dc.contributor.authorPassi, Vikram
dc.contributor.authorSodervall, Ulf
dc.contributor.authorNilsson, Bengt
dc.contributor.authorPetersson, Bengt
dc.contributor.authorHagberg, Mats
dc.contributor.authorKrzeminski, Christophe
dc.contributor.authorDubois, Emmanuel
dc.contributor.authorDu Bois, Bert
dc.contributor.authorRaskin, Jean-Pierre
dc.date.accessioned2021-10-20T14:16:55Z
dc.date.available2021-10-20T14:16:55Z
dc.date.issued2012
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21259
dc.sourceIIOimport
dc.titleAnisotropic vapor HF etching of silicon dioxide for Si microstructure release
dc.typeJournal article
dc.contributor.imecauthorDu Bois, Bert
dc.contributor.orcidimecDu Bois, Bert::0000-0003-0147-1296
dc.source.peerreviewyes
dc.source.beginpage83
dc.source.endpage89
dc.source.journalMicroelectronic Engineering
dc.source.volume95
dc.identifier.urlhttps://doi.org/10.1016/j.mee.2012.01.005
imec.availabilityPublished - imec


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