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Adhesive bonding by SU-8 transfer for assembling microfluidic devices

dc.contributor.authorSalvo, Pietro
dc.contributor.authorVerplancke, Rik
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorLatta, Daniel
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorLiu, Chengxun
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-20T15:39:22Z
dc.date.available2021-10-20T15:39:22Z
dc.date.issued2012
dc.identifier.issn1613-4982
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21447
dc.sourceIIOimport
dc.titleAdhesive bonding by SU-8 transfer for assembling microfluidic devices
dc.typeJournal article
dc.contributor.imecauthorVerplancke, Rik
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorLiu, Chengxun
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVerplancke, Rik::0000-0002-6642-9454
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimecLiu, Chengxun::0000-0002-2104-4657
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage987
dc.source.endpage991
dc.source.journalMicrofluidics and Nanofluidics
dc.source.issue6
dc.source.volume13
imec.availabilityPublished - open access


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