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The BOOM project: towards 160 Gb/s packet switching using SOI photonic integrated circuits and hybrid integrated optical flip-flops

dc.contributor.authorStamatiadis, C.
dc.contributor.authorGomez-Agis, F.
dc.contributor.authorStampoulidis, L.
dc.contributor.authorVyrsokinos, K.
dc.contributor.authorLazarou, I.
dc.contributor.authorDorren, H.J.S.
dc.contributor.authorZimmermann, L.
dc.contributor.authorVoigt, K.
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorDe Heyn, Peter
dc.contributor.authorAvramopoulos, H.
dc.date.accessioned2021-10-20T16:25:43Z
dc.date.available2021-10-20T16:25:43Z
dc.date.issued2012-01
dc.identifier.issn0733-8724
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21547
dc.sourceIIOimport
dc.titleThe BOOM project: towards 160 Gb/s packet switching using SOI photonic integrated circuits and hybrid integrated optical flip-flops
dc.typeJournal article
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorDe Heyn, Peter
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecDe Heyn, Peter::0000-0003-3523-7377
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage22
dc.source.endpage30
dc.source.journalJournal of Lightwave Technology
dc.source.issue1
dc.source.volume30
imec.availabilityPublished - open access


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