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Test structures for characterization of through-silicon vias

dc.contributor.authorStucchi, Michele
dc.contributor.authorPerry, Daniel
dc.contributor.authorKatti, Guruprasad
dc.contributor.authorDehaene, Wim
dc.contributor.authorVelenis, Dimitrios
dc.date.accessioned2021-10-20T16:33:16Z
dc.date.available2021-10-20T16:33:16Z
dc.date.issued2012
dc.identifier.issn0894-6507
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21563
dc.sourceIIOimport
dc.titleTest structures for characterization of through-silicon vias
dc.typeJournal article
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorDehaene, Wim
dc.contributor.imecauthorVelenis, Dimitrios
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage355
dc.source.endpage364
dc.source.journalIEEE Transactions on Semiconductor Manufacturing
dc.source.issue3
dc.source.volume25
imec.availabilityPublished - open access


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