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Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide

dc.contributor.authorWang, Liang
dc.contributor.authorSterken, Tom
dc.contributor.authorCauwe, Maarten
dc.contributor.authorCuypers, Dieter
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-20T18:48:25Z
dc.date.available2021-10-20T18:48:25Z
dc.date.issued2012
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21830
dc.sourceIIOimport
dc.titleFabrication and characterization of flexible ultrathin chip package using photosensitive polyimide
dc.typeJournal article
dc.contributor.imecauthorSterken, Tom
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorCuypers, Dieter
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimecCuypers, Dieter::0000-0003-0550-6273
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1099
dc.source.endpage1106
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue7
dc.source.volume2
imec.availabilityPublished - open access


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