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Multi-scale modeling of direct copper plating on resistive non-copper substrates

dc.contributor.authorYang, Liu
dc.contributor.authorRadisic, Alex
dc.contributor.authorNagar, Magi
dc.contributor.authorDeconinck, Johan
dc.contributor.authorVereecken, Philippe
dc.contributor.authorWest, Alan
dc.date.accessioned2021-10-20T19:12:09Z
dc.date.available2021-10-20T19:12:09Z
dc.date.issued2012
dc.identifier.issn0013-4686
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21875
dc.sourceIIOimport
dc.titleMulti-scale modeling of direct copper plating on resistive non-copper substrates
dc.typeJournal article
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewyes
dc.source.beginpage524
dc.source.endpage531
dc.source.journalElectrochimica Acta
dc.source.volume78
dc.identifier.urlhttp://dx.doi.org/10.1016/j.electacta.2012.06.076
imec.availabilityPublished - imec


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