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dc.contributor.authorCroes, Kristof
dc.contributor.authorDemuynck, Steven
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorWilson, Chris
dc.contributor.authorHeylen, Nancy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-21T07:05:10Z
dc.date.available2021-10-21T07:05:10Z
dc.date.issued2013
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22186
dc.sourceIIOimport
dc.titleFull reliability study of advanced metallization options for 30 nm ½pitch interconnects
dc.typeJournal article
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage210
dc.source.endpage213
dc.source.journalMicroelectronic Engineering
dc.source.volume106
imec.availabilityPublished - imec


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