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Substrate bonding techniques for CMOS processed wafers

dc.contributor.authorvan der Groen, Sonja
dc.contributor.authorRosmeulen, Maarten
dc.contributor.authorBaert, Kris
dc.contributor.authorJansen, Philippe
dc.contributor.authorDeferm, Ludo
dc.date.accessioned2021-09-30T09:47:03Z
dc.date.available2021-09-30T09:47:03Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2218
dc.sourceIIOimport
dc.titleSubstrate bonding techniques for CMOS processed wafers
dc.typeJournal article
dc.contributor.imecauthorRosmeulen, Maarten
dc.contributor.imecauthorDeferm, Ludo
dc.contributor.orcidimecRosmeulen, Maarten::0000-0002-3663-7439
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage108
dc.source.endpage110
dc.source.journalJournal of Micromechanics and Microengineering
dc.source.issue3
dc.source.volume7
imec.availabilityPublished - open access


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