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Millimeter-wave Horn-type antenna-in-package solution fabricated in a teflon-based multilayer PCB technology

dc.contributor.authorEnayati, Amin
dc.contributor.authorVandenbosch, Guy
dc.contributor.authorDe Raedt, Walter
dc.date.accessioned2021-10-21T07:29:03Z
dc.date.available2021-10-21T07:29:03Z
dc.date.issued2013
dc.identifier.issn0018-926X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22309
dc.sourceIIOimport
dc.titleMillimeter-wave Horn-type antenna-in-package solution fabricated in a teflon-based multilayer PCB technology
dc.typeJournal article
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1581
dc.source.endpage1590
dc.source.journalIEEE Transactions on Antennas and Propagation
dc.source.issue4
dc.source.volume61
imec.availabilityPublished - open access


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