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Thermal-stability optimization of Al2O3/Cu-Te based conductive-bridging random access memory systems

dc.contributor.authorGoux, Ludovic
dc.contributor.authorOpsomer, Karl
dc.contributor.authorFranquet, Alexis
dc.contributor.authorKar, Gouri Sankar
dc.contributor.authorJossart, Nico
dc.contributor.authorRichard, Olivier
dc.contributor.authorWouters, Dirk
dc.contributor.authorMuller, Robert
dc.contributor.authorDetavernier, C.
dc.contributor.authorJurczak, Gosia
dc.contributor.authorKittl, Jorge
dc.date.accessioned2021-10-21T07:57:03Z
dc.date.available2021-10-21T07:57:03Z
dc.date.issued2013
dc.identifier.issn0040-6090
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22419
dc.sourceIIOimport
dc.titleThermal-stability optimization of Al2O3/Cu-Te based conductive-bridging random access memory systems
dc.typeJournal article
dc.contributor.imecauthorGoux, Ludovic
dc.contributor.imecauthorOpsomer, Karl
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorKar, Gouri Sankar
dc.contributor.imecauthorJossart, Nico
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorJurczak, Gosia
dc.contributor.orcidimecGoux, Ludovic::0000-0002-1276-2278
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage29
dc.source.endpage33
dc.source.journalThin Solid Films
dc.source.volume533
imec.availabilityPublished - open access
imec.internalnotesEMRS 2012 Symposium L


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