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3D-stacking of ultra-thin chips and chip packages

dc.contributor.authorPriyabadini, Swarnakamal
dc.date.accessioned2021-10-21T11:06:00Z
dc.date.available2021-10-21T11:06:00Z
dc.date.issued2013-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22955
dc.sourceIIOimport
dc.title3D-stacking of ultra-thin chips and chip packages
dc.typePHD thesis
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorVanfleteren, Jan
dc.contributor.thesisadvisorSterken, Tom
imec.availabilityPublished - open access


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