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Controlling physical and chemical bonding of polypyrrole to boron doped diamond by surface termination

dc.contributor.authorUkraintsev, E.
dc.contributor.authorKromka, A.
dc.contributor.authorJanssen, W.
dc.contributor.authorHaenen, Ken
dc.contributor.authorRezek, B.
dc.date.accessioned2021-10-21T13:01:22Z
dc.date.available2021-10-21T13:01:22Z
dc.date.issued2013
dc.identifier.issn1452-3981
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23203
dc.sourceIIOimport
dc.titleControlling physical and chemical bonding of polypyrrole to boron doped diamond by surface termination
dc.typeJournal article
dc.contributor.imecauthorHaenen, Ken
dc.contributor.orcidimecHaenen, Ken::0000-0001-6711-7367
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage17
dc.source.endpage26
dc.source.journalInternational Journal of Electrochemical Science
dc.source.issue1
dc.source.volume8
dc.identifier.urlhttp://www.electrochemsci.org/papers/vol8/80100017.pdf
imec.availabilityPublished - open access


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