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An environment friendly wet strip process for 193 nm lithography patterning in BEOL applications

dc.contributor.authorVereecke, Guy
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorClaes, Martine
dc.contributor.authorLux, Marcel
dc.contributor.authorStruyf, Herbert
dc.contributor.authorCarleer, Robert
dc.contributor.authorAdriaensens, Peter
dc.date.accessioned2021-10-21T14:05:15Z
dc.date.available2021-10-21T14:05:15Z
dc.date.issued2013
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23331
dc.sourceIIOimport
dc.titleAn environment friendly wet strip process for 193 nm lithography patterning in BEOL applications
dc.typeJournal article
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorAdriaensens, Peter
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage119
dc.source.endpage123
dc.source.journalMicroelectronic Engineering
dc.source.volume105
imec.availabilityPublished - open access


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