dc.contributor.author | Wang, Liang | |
dc.contributor.author | Cauwe, Maarten | |
dc.contributor.author | Brebels, Steven | |
dc.contributor.author | De Raedt, Walter | |
dc.contributor.author | Vanfleteren, Jan | |
dc.date.accessioned | 2021-10-21T14:26:31Z | |
dc.date.available | 2021-10-21T14:26:31Z | |
dc.date.issued | 2013 | |
dc.identifier.issn | 0305-6120 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/23374 | |
dc.source | IIOimport | |
dc.title | Self-aligned flat ultra-thin chip package for flexible circuits | |
dc.type | Journal article | |
dc.contributor.imecauthor | Cauwe, Maarten | |
dc.contributor.imecauthor | Brebels, Steven | |
dc.contributor.imecauthor | De Raedt, Walter | |
dc.contributor.imecauthor | Vanfleteren, Jan | |
dc.contributor.orcidimec | Cauwe, Maarten::0000-0002-6413-998X | |
dc.contributor.orcidimec | Brebels, Steven::0000-0002-1568-0286 | |
dc.contributor.orcidimec | De Raedt, Walter::0000-0002-7117-7976 | |
dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 174 | |
dc.source.endpage | 180 | |
dc.source.journal | Circuit World | |
dc.source.issue | 4 | |
dc.source.volume | 39 | |
imec.availability | Published - open access | |