Show simple item record

Self-aligned flat ultra-thin chip package for flexible circuits

dc.contributor.authorWang, Liang
dc.contributor.authorCauwe, Maarten
dc.contributor.authorBrebels, Steven
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-21T14:26:31Z
dc.date.available2021-10-21T14:26:31Z
dc.date.issued2013
dc.identifier.issn0305-6120
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23374
dc.sourceIIOimport
dc.titleSelf-aligned flat ultra-thin chip package for flexible circuits
dc.typeJournal article
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage174
dc.source.endpage180
dc.source.journalCircuit World
dc.source.issue4
dc.source.volume39
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
29057.pdf
Size:
378.1Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record