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Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films

dc.contributor.authorWojcik, Henry
dc.contributor.authorHossbach, Christoph
dc.contributor.authorKubasch, Christoph
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorBarbarin, Yohan
dc.contributor.authorMerkel, Ulrich
dc.contributor.authorBartha, Johann
dc.contributor.authorHubner, Rene
dc.contributor.authorEngelmann, Hans-Jurgen
dc.contributor.authorFriedemann, Michael
dc.date.accessioned2021-10-21T14:40:20Z
dc.date.available2021-10-21T14:40:20Z
dc.date.issued2013
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23400
dc.sourceIIOimport
dc.titleEnhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films
dc.typeJournal article
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.source.peerreviewyes
dc.source.beginpage29
dc.source.endpage34
dc.source.journalMicroelectronic Engineering
dc.source.volume110
dc.identifier.urlwww.elsevier.com/locate/mee
imec.availabilityPublished - imec


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