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System level comparison of 3D integration technologies for future mobile MPSoC platforms

dc.contributor.authorAgrawal, Prashant
dc.contributor.authorMilojevic, Dragomir
dc.contributor.authorRaghavan, Praveen
dc.contributor.authorCatthoor, Francky
dc.contributor.authorVan der Perre, Liesbet
dc.contributor.authorBeyne, Eric
dc.contributor.authorVaradarajan, Ravi
dc.date.accessioned2021-10-22T00:43:14Z
dc.date.available2021-10-22T00:43:14Z
dc.date.issued2014
dc.identifier.issn1943-0663
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23477
dc.sourceIIOimport
dc.titleSystem level comparison of 3D integration technologies for future mobile MPSoC platforms
dc.typeJournal article
dc.contributor.imecauthorAgrawal, Prashant
dc.contributor.imecauthorMilojevic, Dragomir
dc.contributor.imecauthorCatthoor, Francky
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCatthoor, Francky::0000-0002-3599-8515
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage85
dc.source.endpage88
dc.source.journalIEEE Embedded Systems Letters
dc.source.issue4
dc.source.volume6
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6911936&sortType%3Dasc_p_Sequence%26filter%3DAND(p_IS_Number%3A517017
imec.availabilityPublished - imec


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