Show simple item record

New stress activation method for kerfless silicon wafering using Ag/Al and epoxy stress-inducing layers

dc.contributor.authorBellanger, Pierre
dc.contributor.authorCenteno Brito, Miguel
dc.contributor.authorPera, David M.
dc.contributor.authorCosta, Ivo
dc.contributor.authorGaspar, Guilherme
dc.contributor.authorMartini, Roberto
dc.contributor.authorDebucquoy, Maarten
dc.contributor.authorSerra, Joao M.
dc.date.accessioned2021-10-22T00:45:35Z
dc.date.available2021-10-22T00:45:35Z
dc.date.issued2014
dc.identifier.issn2156-3381
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23531
dc.sourceIIOimport
dc.titleNew stress activation method for kerfless silicon wafering using Ag/Al and epoxy stress-inducing layers
dc.typeJournal article
dc.contributor.imecauthorDebucquoy, Maarten
dc.contributor.orcidimecDebucquoy, Maarten::0000-0001-5980-188X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1228
dc.source.endpage1234
dc.source.journalIEEE Journal of Photovoltaics
dc.source.issue5
dc.source.volume4
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/abstractAuthors.jsp?reload=true&arnumber=6862848
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
30811.pdf
Size:
530.4Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record