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Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer

dc.contributor.authorKaur, Kamalpreet
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVan Steenberge, Geert
dc.date.accessioned2021-10-22T02:30:22Z
dc.date.available2021-10-22T02:30:22Z
dc.date.issued2014
dc.identifier.issn0003-6951
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24037
dc.sourceIIOimport
dc.titleFlip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer
dc.typeJournal article
dc.contributor.imecauthorKaur, Kamalpreet
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage61102
dc.source.journalApplied Physics Letters
dc.source.issue6
dc.source.volume104
dc.identifier.urlhttp://scitation.aip.org/content/aip/journal/apl/104/6/10.1063/1.4864406
imec.availabilityPublished - open access


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