dc.contributor.author | Kumaresan, Vishnuvarthan | |
dc.contributor.author | Wilson, Chris | |
dc.contributor.author | Verdonck, Patrick | |
dc.contributor.author | Van Besien, Els | |
dc.contributor.author | Lazzarino, Frederic | |
dc.contributor.author | Truffert, Vincent | |
dc.contributor.author | Boemmels, Juergen | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Wong, T.K.S. | |
dc.date.accessioned | 2021-10-22T02:45:04Z | |
dc.date.available | 2021-10-22T02:45:04Z | |
dc.date.issued | 2014 | |
dc.identifier.issn | 0167-9317 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/24081 | |
dc.source | IIOimport | |
dc.title | Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes | |
dc.type | Journal article | |
dc.contributor.imecauthor | Wilson, Chris | |
dc.contributor.imecauthor | Verdonck, Patrick | |
dc.contributor.imecauthor | Van Besien, Els | |
dc.contributor.imecauthor | Lazzarino, Frederic | |
dc.contributor.imecauthor | Truffert, Vincent | |
dc.contributor.imecauthor | Boemmels, Juergen | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.orcidimec | Verdonck, Patrick::0000-0003-2454-0602 | |
dc.contributor.orcidimec | Van Besien, Els::0000-0002-5174-2229 | |
dc.contributor.orcidimec | Lazzarino, Frederic::0000-0001-7961-9727 | |
dc.contributor.orcidimec | Truffert, Vincent::0000-0001-7851-830X | |
dc.source.peerreview | yes | |
dc.source.beginpage | 90 | |
dc.source.endpage | 94 | |
dc.source.journal | Microelectronic Engineering | |
dc.source.volume | 120 | |
dc.identifier.url | http://www.sciencedirect.com/science/article/pii/S0167931713006928 | |
imec.availability | Published - imec | |