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dc.contributor.authorKumaresan, Vishnuvarthan
dc.contributor.authorWilson, Chris
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorVan Besien, Els
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorTruffert, Vincent
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.authorWong, T.K.S.
dc.date.accessioned2021-10-22T02:45:04Z
dc.date.available2021-10-22T02:45:04Z
dc.date.issued2014
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24081
dc.sourceIIOimport
dc.titleSimulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes
dc.typeJournal article
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorVan Besien, Els
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorTruffert, Vincent
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecVan Besien, Els::0000-0002-5174-2229
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecTruffert, Vincent::0000-0001-7851-830X
dc.source.peerreviewyes
dc.source.beginpage90
dc.source.endpage94
dc.source.journalMicroelectronic Engineering
dc.source.volume120
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0167931713006928
imec.availabilityPublished - imec


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