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Fast convolution based thermal model for 3D-ICs: methodology, accuracy analysis and package impact

dc.contributor.authorMaggioni, Federica
dc.contributor.authorOprins, Herman
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBaelmans, Martine
dc.date.accessioned2021-10-22T03:20:04Z
dc.date.available2021-10-22T03:20:04Z
dc.date.issued2014-12
dc.identifier.issn0026-2692
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24177
dc.sourceIIOimport
dc.titleFast convolution based thermal model for 3D-ICs: methodology, accuracy analysis and package impact
dc.typeJournal article
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage1746
dc.source.endpage1752
dc.source.journalMicroelectronics Journal
dc.source.issue12
dc.source.volume45
dc.identifier.urlhttp://dx.doi.org/10.1016/j.mejo.2014.04.044
imec.availabilityPublished - imec


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